• 半導體晶圓切割用鑽石刀片及磨刀板
• Diamond blades and Dressing board for semiconductor wafer dicing 
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–提供對應日本廠家的各式鑽石刀片及磨刀板

   We offer a variety of diamond blades and Dressing board from Japanese manufacturers.

–適用於晶圓切割及封裝成品Package切割

   Suitable for wafer dicing and package cutting.