• 晶圓級甲酸真空回流爐
• Wafer-level formic acid vacuum reflow oven

–全製程真空腔體中運行，解決錫球內部孔洞及濺錫問題，防止二次氧化

–The entire process operates within a vacuum chamber, eliminating issues such as internal solder ball voids and solder spatter, and preventing secondary oxidation.

–特殊排氣設計，減少Particle產生，高良率及高產出率，延長維保週期

–Special exhaust design reduces particle generation, resulting in high yield and throughput, and extending maintenance cycles.

–全製程含氧量控制，節省氮氣使用成本

–Fully controlled oxygen content reduces nitrogen costs.

–四區上下雙區溫控，配合晶圓高度調整，平緩溫度曲線

–Four-zone upper and lower dual-zone temperature control, combined with wafer height adjustment, provides a smooth temperature profile.

–8/12吋自動切換框架式晶圓移動平台，無需更換治具(可支援至4吋晶圓)

–Automatic 8/12-inch switching frame-type wafer transfer platform eliminates the need for fixture changes (supports up to 4-inch wafers).