• 離子清洗設備 (RF / Microwave)

Plasma cleaning equipment (RF / Microwave)

–專為半導體封裝製程設計的線上RF等離子清洗機。

This in-line RF plasma cleaning system is designed specifically for semiconductor packaging processes.

–針對導線架上點膠、die bonding 及molding製程前清洗，可大幅提升粘接及鍵合強度。

It is ideal for pre-cleaning processes such as lead frame dispensing, die bonding, and molding, significantly improving adhesion and bonding strength.

–在線式自動進出料傳送，避免人為接觸產品而導致的二次污染

Automatic in-line material handling prevents secondary contamination from human contact with the product.

–優於腔體式批量清洗，用時較短且避免晶片損傷。

This system outperforms chamber-based batch cleaning, shortening cleaning times and minimizing wafer damage.