• 真空壓膜及膜厚調整系統
  Vacuum lamination and film thickness adjustment system

–有別於傳統滾輪式的貼膜機，在真空環境下貼附乾膜的創新設計

–Unlike traditional roller-type laminators, this innovative design applies dry film in a vacuum environment.

–獨家開發氣囊式軟墊加熱壓合，真空 / 壓力 / 溫度 可獨立設置符合材料應用

–Uniquely developed airbag-type soft-cushion heating and lamination allows independent adjustment of

vacuum, pressure, and temperature to suit the material application.

–適用於ABF壓膜、NCF壓膜、Mold film壓膜以及TSV/TGV電鍍後填孔

–Suitable for ABF lamination, NCF lamination, mold film lamination, and post-TSV/TGV via filling.

–全自動化設備，可適用 8寸及 12寸晶圓，最大可適用至700mmx700mm面板級封裝製程

–Fully automated, it is suitable for 8-inch and 12-inch wafers and panel-level packaging processes up to 700mm x 700mm.

–可擴充壓膜後整平機構，進行二次表面平坦度優化。

–Post-lamination leveling can be expanded for secondary surface flatness optimization.