真空 壓力除泡系統
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真空 壓力除泡系統
真空 壓力除泡系統
詳細介紹:
- 真空/壓力除泡系統 Variable pressure defoaming system
–有效去除晶粒黏著(Die Attached)，光學膜貼附 (OCA lamination) 氣泡問題。
Effectively removes bubbles during die attachment and optical film lamination.
–利用真空+壓力交互切換的的模式,實現大氣泡去除，大幅提高UPH
Utilizes alternating vacuum and pressure modes to remove large bubbles and significantly improve UPH.
–快速解決灌注封膠(Potting), 底部填膠(Underfill), 印刷塗膠(Printing) 氣泡問題。
Quickly resolves bubble issues during potting, underfill, and printing.
–可設定壓力0-8kg, 溫度可達200~400℃。
Adjustable pressure from 0-8kg and temperature from 200°C to 400°C.
