• 全自動鐳射開槽設備
• Fully Automatic Laser Slotting Equipment

–利用鐳射對晶圓切割道進行開槽，解決Low-k 製程的晶圓使用刀輪切割時存在脫層問題。

Laser grooving of wafer dicing streets solves the delamination problem that often occurs when using a dicing wheel on Low-k process wafers.

–通過使用鐳射開槽，可抑制脫層，實現高品質加工。

Laser grooving suppresses delamination and achieves high-quality processing.

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• 晶圓正/背面打標設備
• Wafer Front/Back Marking Equipment

–利用鐳射對晶圓上ID和每個晶片進行指定文字或標記列印。

Laser-prints the wafer ID and individual wafers with designated text or markings.

–配備上下兩個鐳射單元，具備正/背面Unit打標和晶圓ID打標功能。

Equipped with two upper and lower laser units, it supports front/back unit marking and wafer ID marking.

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• 塑封後打標機 (Strip type)
• Marking Equipment (Strip Type)

–全自動鐳射打標機適用於封裝後產品的打標。

This fully automatic laser marking machine is ideal for marking packaged products.

–支持Slot Magazine和Stack Magazine兩種上下料方式依據客戶制程要求可形成1 in 1 out、2 in 2 out機型。

It supports both slot magazine and stack magazine loading and unloading methods, enabling 1-in-1-out and 2-in-2-out configurations based on customer process requirements.

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• 塑封後打標機 (IC in Tray / IC on boat type)
• Marking Equipment (IC in Tray / IC on Boat Type)

–全自動 IC In tray 鐳射打標機適用於IC單顆封裝產品，定位精准，具備自主檢測功能，可根據客戶需求選配挑補功能。

The fully automatic IC In-Tray laser marking machine is suitable for single IC package products. It features precise positioning, self-inspection capabilities, and an optional pick-and-place function based on customer needs.

–IC On Boat 鐳射打標機，適用於先進封裝制程中FCBGA基板的Ring、散熱該（電鍍類）、Si等產品，進行二維碼、字元、LOGO等自訂樣式文本列印的全自動設備。具備翻轉功能，有效的相容後段的植球需求（Option）。

The IC On-Boat laser marking machine is suitable for fully automatic printing of custom text such as QR codes, characters, and logos on FCBGA substrate rings, heat sinks (electroplating), and silicon in advanced packaging processes. It also features a flip function, effectively accommodating back-end ball placement requirements (optional).

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• 晶圓玻璃通孔（TGV）設備
• Wafer Through Glass Via (TGV) Equipment

–本設備主要利用鐳射進行誘導不同材質0.1~1mm厚晶圓玻璃的微孔加工（TGV）的全自動設備。

This fully automated laser-induced microvia (TGV) machine primarily performs microvia machining (TGV) on 0.1-1mm thick glass wafers of various materials.

–可以實現各種尺寸盲孔、圓錐（通）孔的製備。

It can create blind holes and conical (through) holes of various sizes.