• 玻璃載板(代理產品)

Glass carrier plate (agent product)

–群創光電 FOPLP / FOSLP

   Innolux FOPLP / FOSLP

•    以玻璃玻璃材料的穩定性及平整度作為載體，利用PI增層及RDL製程在玻璃上生成線路，取代有機芯材的薄型載板       技術

   Leveraging the stability and flatness of glass as a substrate, PI build-up and RDL processes are used to create       circuits on glass, replacing thin substrate technologies with organic core materials.

•    佈線密度極限值於 5~10µm 間(2µm開發中)，減少 I/O 密度受限率

   The wiring density limit is between 5 and 10µm (2µm is under development), reducing I/O density       

    constraints.

•     FOPLP採用了方形玻璃基板可更有效率的滿足多顆大尺寸晶片的封裝需求。

    FOPLP utilizes a square glass substrate to more efficiently meet the packaging needs of multiple large chips.

•     FOSLP可將FOP裁切與現行封裝相同尺，並與現行封裝設備共用，省去廠房建設及新設備的投資成本

    FOSLP allows FOPs to be cut to the same size as existing packaging and can be used with existing packaging        equipment, eliminating the need for factory construction and investment in new equipment.