晶化科技膜材 WaferChem Film material

–晶圓背面保護膜 Wafer Protection Film

• 薄型晶圓的保護膜，有效減少元件體積

A protective film for thin wafers, effectively reducing component size.

• 適用於WLCSP & Fan-Out製程，有效減少切割晶圓造成的脆裂現象

Suitable for WLCSP and Fan-Out processes, effectively reducing wafer cracking caused by dicing.

• 具備Rework特性，貼合後可重工，不殘膠

Reworkable, allowing for rework after lamination without residual adhesive.

• 良好的雷射打印品質

Excellent laser printing quality.

• 良好的界面接著能力

Excellent interfacial adhesion.

• 極佳的散熱性

Excellent heat dissipation.

–塑封膠膜 Molding Film

• 平整度高

High flatness

• 具優異耐化性

Excellent chemical resistance

• 介面接著力強 (Glass wafer也適用)

Strong interface adhesion (also suitable for glass wafers)

• 硬度高，可保護晶粒

High hardness protects the die

• 應用在COB, COG LED製程

Applicable in COB and COG LED manufacturing processes