• 半導體用膠帶 Tape

–研磨膠帶 Grinding Tape

• 貼附於晶圓正面，保護晶圓正面結構在背面研磨時不受汙染及損傷

Protects the wafer's front-side structure from contamination and damage during backside grinding.

• 具有優異的耐熱性及保護性，更可藉由紫外線(UV)照射降低黏著力，解決剝離殘膠問題

It offers excellent heat resistance and protection and can reduce adhesion through ultraviolet (UV) irradiation, eliminating adhesive residue issues during peeling.

–切割膠帶 Dicing Tape

• 應用於晶圓切割及撿晶製程，具備穩定的黏著性及優異的延展性

Used in wafer dicing and wafer picking processes, it offers stable adhesion and excellent ductility.

• 可藉由紫外線(UV)照射解離降低黏著力，提高撕膜效率及撿晶效率

Ultraviolet (UV) radiation can be used to dissociate the adhesive, reducing adhesion and improving film removal and wafer picking efficiency.

–耐高溫/耐等離子轟擊膠帶 Heat & Plasma resistant dicing tape

• 兼具耐熱膠帶及切割膠帶的特性，適用於晶圓切割後再製程，例如reflow / Plasma等製程
• Combining the properties of both heat-resistant and dicing tapes, it's suitable for post-wafer dicing processes, such as reflow and plasma processing.

• 省去膠帶轉換及避免轉換時造成晶片損傷的風險，並提升產線效率

This eliminates the need for tape changes and the risk of wafer damage during these changes, improving production line efficiency.

–熱解離/熱發泡膠帶 Thermal release tape / Thermal foaming tape

• 具高黏著性及穩定性的特殊黏膠
• A special adhesive with high adhesion and stability.

• 可應用於多種製程，製程結束後只需加熱到特定溫度，即可使膠層降低黏度容易脫離，且不留殘膠

It can be used in a variety of processes. After the process is completed, simply heating it to a specific temperature will reduce the viscosity of the adhesive layer, making it easy to remove without leaving any adhesive residue.

–防焊膠帶 Polyimide tape

• 使用高耐熱PI膜上塗布特殊矽膠，高溫時穩定性佳，

A special silicone coating on a high-heat-resistant PI film provides excellent stability at high temperatures.

• 應用於DFN/QFN封裝Molding製程，避免compound 溢出，撕除後不殘膠

This is used in the DFN/QFN package molding process to prevent compound overflow and leave no adhesive residue after removal.